Thermal Management Solutions

Thermal Management Solutions

Enhancing Heat Dissipation and Performance

Thermal management solutions encompass a range of materials and technologies designed to dissipate heat efficiently and improve the performance and reliability of electronic devices, automotive systems, and industrial equipment. These solutions include thermal interface materials, heat sinks, thermal adhesives, and phase change materials.

Key Features:

My-T-Bond® 2520 (A&B) is a thermally conductive room temperature curing 2K-Epoxy system. Application includes permanent bonding of electronic devices for...

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Thermal Management Solutions

My-T-Bond 2520
My-T-Sil® 3002 (A & B) is a 2-component thermally conductive silicone elastomer system. It is specially designed for protection of...

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Thermal Management Solutions

My-T-Sil 3002
My-T-Sil® 3005 (A & B) is a 2-component thermally conductive silicone elastomer system specially designed for protection of electrical and...

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Thermal Management Solutions

My-T-Sil 3005
My-T-Sil® 3920 (A&B) is a two component thermally conductive silicone elastomer system specially designed to be used as a thermal...

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Thermal Management Solutions

My-T-Sil 3920
My-T-Sil® 932 is a one part neutral cure thermally conductive silicone sealant. It cures at room temperature by reaction with...

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Thermal Management Solutions

My-T-Sil 932
My-T-Therm®100 TCG is a non-curing thermal interface material designed to transfer thermal energy from a heat source to a heat...

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Thermal Management Solutions

My-T-Therm 100 TCG
My-T-Therm®200 TCG is a non-curing thermal interface material design to transfer thermal energy from a heat source to a heat...

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Thermal Management Solutions

My-T-Therm 200 TCG
My-T-Therm®300 TCG is a non-curing thermal interface material design to transfer thermal energy from a heat source to a heat...

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Thermal Management Solutions

My-T-Therm 300 TCG