My-T-Bond 1125

My-T-Bond 1125

My-T-Bond® 1125 is a two component free flowing acrylic adhesive for potting and Encapsulation of components penetrating gap is very small.

  • Low Viscosity
  • High Structural and Impact Strength
  • Fast setting, rapid fixing.
  • Solvent Free
  • Excellent Gap Filling Properties

Pack Size:

My-T-Bond ® 1125 is ideally available in

  • 50 ml Cartridge

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Product Features & Benefits

 Two Component Adhesive (Resin and hardener)
 Very low viscosity and free flowing nature ensures encapsulation in even minute gaps.
 Can be used in Potting and Encapsulation of small wires and cables where high structural strength is desired.
 Good adhesion and Bonding Strength to wide variety of substrates.

Specification

Sr No Properties Value
1.) Appearance (Resin) Light Pink
Appearance (Hardener) Straw Colored
2.) Technology Acrylic
3.) Mix ratio (By Weight) 1:1
4.) Pot life 20-22 min.
5.) Specific Gravity @ 25±2°C (Resin) 1.05
6.) Specific Gravity @ 25±2°C (Hardener) 1.05
7.) Viscosity @ 25±2°C, Brookfield, Spindle #2, Speed 100 RPM (Resin) 100-150 cP
8.) Viscosity @ 25±2°C, Brookfield, Spindle #2, Speed 100 RPM (Hardener) 100-150 cP
9.) Tensile Strength ASTM D897 (Steel-Steel) 23-30 N/mm2
10.) Lap Shear Strength ASTM D1002 (Steel-Steel) 30-40 N/mm2
11.) Hardness, Shore A, ASTM D2240 68-70