My-T-Bond 2689

My-T-Bond 2689

My-T-Bond® 2689 is high strength adhesive developed for structural applications. It is one component heat curable industrial grade epoxy adhesive.

  • High Strength
  • High Toughness
  • High Peel Strength

Pack Size:

My-T- Bond® 2689 is ideally available in

  • 1 kg Pack

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Product Features & Benefits


 It develops to a tough and strong bond after curing and has good peel strength
 For bonding of sheet metal stiffeners, magnets, magnet core assembly and other structural application where high mechanical strength is desired. Applied to CRS, electro-galvanized or aluminum substrates.
 For bonding various plastic, metal, glass, ceramic and masonry materials where high strength is required.

Specification

Sr No Properties Value
1.) Appearance Grey
2.) Strength High
3.) Specific Gravity @ 25±2°C 1.16±0.03
4.) Lap Shear Strength, ASTM D 1002; heat Steel  ≥ 45 N/mm²
5.) Tensile Strength, ASTM D 897 Steel ≥ 40 N/mm²
6.) Peel Strength, ASTM D1876 Steel ≥ 8 N/mm
7.) Viscosity Brookfield, DV-II, Spindle No T-F, Speed 1 rpm 5000000-7000000 cP
8.) Technology Epoxy 1K
9.) Cure schedule Heat Cure for 30 minute @ 155 to 195° C