My-T-Therm 84

My-T-Therm® 84 is a thermally conductive adhesive designed for bonding heat generating components to heat sinks.

  • Good Thermal Conductivity
  • Rapid Fixture

Pack Size:

My-T- Therm® 84 is ideally available in 20 ml blister pack.

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Product Features & Benefits

 Excellent heat dissipation for thermally sensitive components
 Controlled strength permits field and service repair.
 Application includes bonding Transformers, Transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.


Sr No Properties Value
1.) Technology Acrylic
2.) Components One Component
3.) Appearance (uncured) White to off-white paste
4.) Specific Gravity @ 25ºC 2.33±0.03
5.) Viscosity @ 25±2ºC High
6.) Service Temperature -50º to 150ºC
7.) Cure Activator
8.) Tensile Strength ASTM D897, Aluminum 8-12 N/mm²
9.) Lap Shear Strength ASTM D1002, Aluminum 6-10 N/mm²
10.) Coefficient of Thermal Expansion, ASTM E 228 69×10-6 K-1/td>
11.) Thermal Conductivity ISO 22007 1.2 W/m-k