Description
Product Advantages
Used for industrial assemblies for multi-purpose applications
Suitable for bonding and potting electronic components.
Used for bonding of metals, electronic components, GRP structures.
My-T-Bond® 2738 is a 2K-Epoxy room temperature curing, thixotropic adhesive; it bonds and repairs a wide variety of materials.
- offer superior thermal shock resistance
- Shows good mechanical, electrical and impact resistant properties.
- Free Flowing
Pack Size:
My-T- Bond® 2738 is ideally available in
- 50 ml and 400 ml dual cartridge
- 1 kg and 5 kg packing containers
Specification
| Sr No | Properties | Value |
|---|---|---|
| 1.) | Appearance; Component (A)
Component (B) Mixed (Part A + Part B) |
Black
Slight Yellow Black |
| 2.) | Mix ratio by weight; Part A: Part B | 100:80 |
| 3.) | Pot Life @25 ±2 °C (10gm mix) | 3 min |
| 4.) | Lap Shear Strength, ASTM D 1002; Steel | 10-13 N/mm² |
| 5.) | Impact Strength, ASTM D 950; Steel | >35 N/mm² |
| 6.) | Viscosity; Component (A)
Component (B), Brookfield, Spindle 6, Speed 20 r.p.m@25±2C |
13000-15000 cP
10000 -16000 cP |
