My-T-Bond 2619

My-T-Bond® 2619 is a heat curable one component high viscosity, industrial grade epoxy adhesive.

  • Excellent adhesion to wide range of substrates
  • High bond strength
  • Withstands heavy impact loads
  • Extremely durable and tough

Pack Size:

My-T- Bond® 2619 is ideally available in

  • 1 kg Pack

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Specification

Sr No Properties Value
1.) Appearance White/Black
2.) Strength High
3.) Specific Gravity @ 25±2°C 1.17±0.05
4.) Lap Shear Strength, ASTM D 1002 Steel, Heat cure@120 °C for 60 min                        20-25 N/mm²
5.) Tensile Strength, ASTM D 897 Steel, Heat cure@120 °C for 60 min 18-22 N/mm²
7.) Viscosity Brookfield, DV-II, Spindle No. 7, Speed 20 rpm 150000-200000 cP
8.) Technology Epoxy 1K
9.) Cure schedule @120°C

@150°C

60 minutes

15 minutes