My-T-Bond 2709

My-T-Bond® 2709 is a high strength, 2K Structural epoxy Room temperature curing, thixotropic adhesive.

  • It bonds and repairs a wide variety of materials
  • It offers superior thermal shock resistance and impact resistant properties
  • Used for bonding heavy metal parts
  • Suitable for bonding electronic components and mesh to frames

Pack Size:

My-T- Bond® 2709 is ideally available in

  • 50 ml and 400 ml dual cartridge

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Description

Product Features & Benefits

 It offers superior thermal shock resistance and impact resistant properties.
 Used for industrial assemblies for multi-purpose applications viz. spindle motor assembly, magnet bonding
 Used for bonding of metals, electronic components, GRP structures
 Favored for higher than normal temperature or more aggressive environment

Specification

Sr No Properties Value
1.) Appearance;

Component (A)

Component (B)

Mixed (Part A + Part B)

  

Off-White

Amber

Off-White
2.) Mix ratio by weight; (Part A: Part B) 2:1
3.) Pot Life @25 ±2 °C(gm mix) 30 min
4.) Lap Shear Strength, ASTM D 1002;

Steel

 25 – 30 N/mm²
5.) Tensile Strength, ASTM D 897;

Steel

 25 – 30 N/mm²
6.) Viscosity;
Component (A)
Component (B),
Brookfield, Spindle 6, Speed 10 r.p.m@25±2C		 35000-50000 cP
15000-20000 cP

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