Description
Product Advantages
Used for industrial assemblies for multi-purpose applications
Also suitable for bonding, potting and encapsulating electronic components
My-T-Bond® 2710 is a clear, medium viscosity, room temperature curing 2K-Epoxy system.
Pack Size:
My-T- Bond® 2710 is ideally available in
| Sr No | Properties | Value |
|---|---|---|
| 1.) | Appearance;
Component (A) Component (B) Mixed (Part A + Part B) |
Clear Clear Clear |
| 2.) | Mix ratio by weight; (Part A: Part B) | 2:1 |
| 3.) | Pot Life @25 ±2 °C (100 gm mix) | 30 min |
| 4.) | Lap Shear Strength, ASTM D 1002;
Steel |
≥ 6 N/mm² |
| 5.) | Tensile Strength, ASTM D 897;
Steel |
≥ 7 N/mm² |
| 6.) | Viscosity; Component (A) Component (B), Brookfield, Spindle 6, Speed 20 r.p.m@25±2C |
11000 – 13000 cP 14000 – 16000 cP |