My-T-Bond 2722

My-T-Bond® 2722 is a solvent free, low viscosity two component epoxy adhesive with moderate work life and slow cure at ambient temperature.

  • Formulated and processed to obtain void free casting, potting encapsulated components.
  • Low exothermic
  • It has excellent resistance to oil, water & wide variety of solvents.
  • The cured polymer shows good mechanical, electrical & chemical properties.

Pack Size:

My-T- Bond® 2722 is ideally available in containers in polyethylene containers / HDPE Drum.

  •  250 gm, 1 kg, 2 kg, 5 kg, 10 kg and 50 kg pack 

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Description

Product Features & Benefits

 Suitable for Potting, Encapsulation & coating
 Potting of auto electrical components
 Casting of switch gear components and insulators
 Potting of instrument transformers
 Cable joint insulation, with all types of cables such as PILC, PVC, and Rubber insulated
 Topping of capacitors as sealant.

Specification

Sr No Properties Value
1.) Appearance;

Component (A)

Component (B)

Mixed (Part A + Part B)

  

Black

Pale Yellow

Black
2.) Mix ratio by weight; (Part A: Part B) 2:1, 3:1, 4:1
3.) Pot Life @25 ±2 °C (100 gm mix) 65 min
4.) Viscosity;
Component (A)
Component (B),
Brookfield, Spindle 6, Speed 20 r.p.m@25±2C		 11300 – 14500 cP
2750 – 4000 cP

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