My-T-Bond 2722

My-T-Bond^® 2722 is a solvent free, low viscosity two component epoxy adhesive with moderate work life and slow cure at ambient temperature.

Formulated and processed to obtain void free casting, potting encapsulated components.
Low exothermic
It has excellent resistance to oil, water & wide variety of solvents.
The cured polymer shows good mechanical, electrical & chemical properties.

Pack Size:

My-T- Bond^® 2722 is ideally available in containers in polyethylene containers / HDPE Drum.

Suitable for Potting, Encapsulation & coating

Potting of auto electrical components

Casting of switch gear components and insulators

Potting of instrument transformers

Cable joint insulation, with all types of cables such as PILC, PVC, and Rubber insulated

Topping of capacitors as sealant.

Specification

Sr No	Properties	Value
1.)	Appearance; Component (A) Component (B) Mixed (Part A + Part B)	Black Pale Yellow Black
2.)	Mix ratio by weight; (Part A: Part B)	2:1, 3:1, 4:1
3.)	Pot Life @25 ±2 °C (100 gm mix)	65 min
4.)	Viscosity; Component (A) Component (B), Brookfield, Spindle 6, Speed 20 r.p.m@25±2C	11300 – 14500 cP 2750 – 4000 cP