My-T-Bond 2520

My-T-Bond 2520

My-T-Bond® 2520 (A&B) is a thermally conductive, room temperature curing 2K-Epoxy system. Application includes permanent bonding of electronic devices for higher thermal dissipation, Used in electronic assemblies for potting and encapsulating PCB and devices requiring high thermal dissipation.

Pack Size:

My-T- Bond® 2520 is ideally available in 1 kg and 5oo gm packing containers and 400 ml Cartridge Packs

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Product Features & Benefits

 Good Bonding Strength
 Good Flow ability
 Bond to various electrical and electronics assemblies to dissipate heat efficiently
 Excellent Thermal Conductivity

Specification

Sr No Properties Value
1.) Appearance (Mix) Blue
2.) Mix ratio by weight; Part A: Part B 1:1
3.) Pot Life @25 ±2 °C(100gm mix) 30 – 45 minutes
4.) Lap Shear Strength, ASTM D 1002; Steel ≥ 3 N/mm2
5.) Tensile Strength, ASTM D897; Steel ≥ 3 N/mm2
6.) Viscosity (Mix) 280000±15000cP
7.) Thermal Conductivity, ISO 22007 2 W/mk