My-T-Therm 200 TCG

My-T-Therm®200 TCG is a non-curing thermal interface material design to transfer thermal energy from a heat source to a heat sink.

  • Medium Viscosity
  • High thermal conductivity
  • Electric Resistance over wide temperature range

Pack Size:

My-T-Therm®200 TCG is ideally available in

  • 500 gm and 1 Kg Pack

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Sr No Properties Value
1.) Appearance White Paste
2.) Specific Gravity 2.93
3.) Service Temperature Range -50 to200° C
4.) Thermal Conductivity, ISO 22007 2.2 W/mk
5.) Viscosity Brookfield DV II+ Pro

Spindle#7 Speed 20 rpm, ASTM D1084


85000 to 90000 cP