My-T-Therm 200 TCG

My-T-Therm 200 TCG

My-T-Therm®200 TCG is a non-curing thermal interface material design to transfer thermal energy from a heat source to a heat sink.

  • Medium Viscosity
  • High thermal conductivity
  • Electric Resistance over wide temperature range

Pack Size:

My-T-Therm®200 TCG is ideally available in

  • 500 gm and 1 Kg Pack

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Product Features & Benefits

 Non-curing
 High thermal conductivity.
 Stable at high temperature.
 Low oil bleed.
 Application includes gap filling in processor chips, CPU, transistor thermal modules and other heat generated electronic components to PCB’s assemblies, and LED Lights.

Specification

Sr No Properties Value
1.) Appearance White Paste
2.) Specific Gravity 2.93
3.) Service Temperature Range -50 to200° C
4.) Thermal Conductivity, ISO 22007 2.2 W/mk
5.) Viscosity Brookfield DV II+ Pro

Spindle#7 Speed 20 rpm, ASTM D1084

 

85000 to 90000 cP