My-T-Therm 70 TCG

My-T-Therm®70 TCG is a non-curing thermal interface material designed to transfer thermal energy from a heat source to a heat sink.

  • High Viscosity
  • Good thermal conductivity
  • Electric Resistance over wide temperature range

Pack Size:

My-T-Therm®70 TCG is ideally available in

  • 500 gm and 1 Kg Pack

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Description

Product Features & Benefits

 Non-curing
 Good thermal conductivity.
 Stable at high temperature.
 Low oil bleed.
 Application includes gap filling in processor chips, CPU, transistor thermal modules and other heat generated electronic components to PCB’s assemblies, and LED Lights.

Specification

Sr No Properties Value
1.) Appearance Off White Paste
2.) Specific gravity 1.84
3.) Service Temperature Range -50 to150° C
4.) Thermal Conductivity, ISO 22007 0.7 W/mk
5.) Viscosity Brookfield DV II+ Pro

Spindle#7 Speed 5 rpm, ASTM D1084

 200000 to 250000 cP

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