Description
Product Features & Benefits
Good Bonding Strength
Good Flow ability
Bond to various electrical and electronics assemblies to dissipate heat efficiently
Excellent Thermal Conductivity
My-T-Bond® 2520 (A&B) is a thermally conductive, room temperature curing 2K-Epoxy system. Application includes permanent bonding of electronic devices for higher thermal dissipation, Used in electronic assemblies for potting and encapsulating PCB and devices requiring high thermal dissipation.
Pack Size:
My-T- Bond® 2520 is ideally available in 1 kg and 5oo gm packing containers and 400 ml Cartridge Packs
Specification
| Sr No | Properties | Value |
|---|---|---|
| 1.) | Appearance (Mix) | Blue |
| 2.) | Mix ratio by weight; Part A: Part B | 1:1 |
| 3.) | Pot Life @25 ±2 °C(100gm mix) | 30 – 45 minutes |
| 4.) | Lap Shear Strength, ASTM D 1002; Steel | ≥ 3 N/mm2 |
| 5.) | Tensile Strength, ASTM D897; Steel | ≥ 3 N/mm2 |
| 6.) | Viscosity (Mix) | 280000±15000cP |
| 7.) | Thermal Conductivity, ISO 22007 | 2 W/mk |
